3D Packaging Technology and Applications

This one day seminar explores various 3D packaging technologies, trends, and applications. A brief outline of topics covered are as follows:

• Introduction to 3D Packaging Technologies
• 3D Integration: Brief history, Definition, Scope
• Why 3D?
• TSV: Process, Application, Players, Market, Cost
• Silicon/glass Interposer: Process, Application, Players, Market, Cost
• Interpose Approach-2.5D: Pros/Cons, Selection Guideline
• 3D integration Infrastructure: Bonding, Thinning, Handling
• 3D-IC Approach
• 3D Challenges
• Summary

This seminar is intended for designers, product and project application personnel, managers and technologists interested in understanding this exciting and growing technology. To find out more about this seminar and to register please contact info@isqed.com or call +1-408-436-3000.